ISL5216
Plastic Ball Grid Array Packages (BGA)
o
A1 CORNER
A1 CORNER I.D.
D
A
V196.12x12
196 BALL PLASTIC BALL GRID ARRAY PACKAGE
INCHES
MILLIMETERS
SYMBOL
A
MIN
-
MAX
0.059
MIN
-
MAX
1.50
NOTES
-
E
A1
A2
b
D/E
D1/E1
0.012
0.037
0.016
0.468
0.405
0.016
0.044
0.020
0.476
0.413
0.31
0.93
0.41
11.90
10.30
0.41
1.11
0.51
12.10
10.50
-
-
7
-
-
TOP VIEW
B
N
e
196
0.032 BSC
196
0.80 BSC
-
-
0.15
0.006
0.08
0.003
M C A B
M C
D1
A1
CORNER
MD/ME
bbb
aaa
14 x 14
0.004
0.005
14 x 14
0.10
0.12
3
-
-
b
14 13 12 11 10 9 8 7 6 5 4 3 2 1
A1
CORNER I.D.
NOTES:
Rev. 2 12/00
A
B
C
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
S
D
E
F
2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3. “MD” and “ME” are the maximum ball matrix size for the “D”
G
H
J
E1
and “E” dimensions, respectively.
4. “N” is the maximum number of balls for the specific array size.
A
K
L
M
N
P
e
5. Primary datum C and seating plane are defined by the
spherical crowns of the contact balls.
6. Dimension “A” includes standoff height “A1”, package body
thickness and lid or cap height “A2”.
7. Dimension “b” is measured at the maximum ball diameter,
S
A
ALL ROWS AND COLUMNS
parallel to the primary datum C.
8. Pin “A1” is marked on the top and bottom sides adjacent to A1.
C
A1
A2
BOTTOM VIEW
bbb C
aaa C
9. “S” is measured with respect to datum’s A and B and defines
the position of the solder balls nearest to package
centerlines. When there is an even number of balls in the
outer row the value is “S” = e/2.
V196.15x15 package information available on Intersil’s website.
A
SEATING PLANE
SIDE VIEW
V
64
FN6013.3
July 13, 2007
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